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Gen3 Systems Limited, FINEPLACER Lambda Die Bonding System

MANUFACTURER Finetech (manufacturer's website)
CONTACT 1 Natalie Henderson
CONTACT 2 Stephen.Robson@ncl.ac.uk
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Automated processes Overlay vision alignment system (VAS) with fixed beam splitter Integrated Process Management (IPM) Real time process observation camera Advanced system software with adaptive process library Process transfer from system to system Process flexibility due to modular concept


Placement accuracy: 5 µm Field of view (min)1: 1.6 mm x 1.2 mm Field of view (max)1: 20 mm x 15 mm Component size (min)1: 0.125 mm x 0.125 mm Component size (max)1: 40 mm x 40 mm Theta fine travel2: ± 6° Z-travel2 10 mm Working area1: 280 mm x 117 mm Heating temp. (max)1,2*: 400 °C Bonding force (max)1,2*: 700 N

Item ID #1500.

Last Updated: 14th September, 2015